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Precision Cleaning

Precision Cleaning

What is cleaning?Main cleaning techniquesCleaning applicable images

What is cleaning?

Cleaning is the engineering process of removing pollutants generated during the production process of customer service equipment accessories
By using various cleaning methods to remove pollution in customer manufacturing engineering, extend the service life of accessories, improve the yield of customer processes, maximize the start-up rate, and provide customers with various cleaning solutions to save costs.

Initial cleaning stage
  • Introduction of semiconductor accessory cleaning technology
  • Precise cleaning of various materials and processes
  • Improve physical cleaning technology →
    CO2 Cleaning, Bead, Arc Coating
  • 0.3 ㎛ Size P/C control
Optimization of Product Surface Treatment
  • Improve various physical cleaning technologies →
    Meeting the diverse needs of customers
  • Multi functional products; Product cleaning of composite materials
  • Accuracy of cleaning process
  • 0.1 ㎛ Size P/C control
Introducing Nano cleaning technology
  • Optimization of surface treatment → improvement of process yield
  • Reduce P/C Source by increasing the surface area of the product
  • Accuracy of cleaning process → Introduction of quality management system
  • 0.04 ㎛ Size P/C control
Development of Nano cleaning technology
  • SMART Factory – Automation
  • Apply different solutions based on different products
  • Micro process control → reducing customer process defects
  • Development of Environmental Cleaning Technology
  • Product lifespan increases, delivery time decreases
  • 0.01um Size P/C Control

Main cleaning techniques

Provide appropriate cleaning techniques based on customers' various processes and accessories< br /> Not only does it remove process pollutants, but it also maintains the surface of accessories in the optimal state, controlling particles, and continuously researching and developing to provide the best solution for extending product life

  CuStrip™ CleanPeel™ SurFinish™ SurfRestore™
Purpose of use Minimize the damage to the base material of accessories suitable for Cu process and remove process pollutants Extend product life by minimizing accessory damage Al CVDShowerhead base metal and HoleDamage reduction Restoring PlasmaEtching Surface Damage of Quartz Material Products
Effect Reduce Etch Rate of Base Metal
Extend product life
Extend product life Particle Source reduction
Maintain GasFlowUniformity
Improving Particles
Extending Product Life
Applicable products Al Collimator, Al CoverRing, etc PVD Process Shield Class CVD Process Show erhead Quartz Window,
Quartz pedal et al
effect

MoreCleaning applicable images

TEL VIGUS LK2 ESC
TEL VIGUS LK2 ESC
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
TRAP..CTR-3ALS1-55
UNDER SHIELD DEPO
UNDER SHIELD DEPO
UNDER SHIELD DEPO
UNDER SHIELD DEPO
UNDER SHIELD DEPO 180 V2E
UNDER SHIELD DEPO 180 V2E
UNDER SHIELD DEPO 180 V2E
UNDER SHIELD DEPO 180 V2E
UNDER SHIELD DEPO 180 V2E
UNDER SHIELD DEPO 180 V2E
UNDER SHIELD DEPO 180 V2E
UNDER SHIELD DEPO 180 V2E
UPPER INNER CHAMBER
UPPER INNER CHAMBER
UPPER INNER CHAMBER
UPPER INNER CHAMBER
UPPER INNER CHAMBER
UPPER INNER CHAMBER
UPPER INNER CHAMBER
UPPER INNER CHAMBER
WINDOW(Q).BLANK EPD V2
WINDOW(Q).BLANK EPD V2
WINDOW(Q).BLANK EPD V2
WINDOW(Q).BLANK EPD V2
WINDOW(YC).SHIELD DEPO V2
WINDOW(YC).SHIELD DEPO V2
WINDOW(YC).SHIELD DEPO V2
WINDOW(YC).SHIELD DEPO V2
WINDOW(YC).SHIELD DEPO V2
WINDOW(YC).SHIELD DEPO V2
WINDOW(YC).SHIELD DEPO V2
WINDOW(YC).SHIELD DEPO V2